Established in 1926, the Okamoto Corporation has made a name as a market leader in the production of surface automatic and CNC grinding machines. Known in the industry as a Total Abrasive Process Machine manufacturer, Okamoto provides the most advanced grinding technology in the industry with uncompromising dedication to quality and repeatability. Their diverse line-up of highly reliable and accurate NC and CNC grinding machines also known as grinders, range from precise toolroom applications to the most demanding high-production runs. Okamoto offers a variety of capabilities in internal, cylindrical, surface, rotary, and gear grinding along with other specialty grinding machines. Compared to their competitors, Okamoto offers the highest-quality NC and CNC grinding machines for more abrasive finishing applications.
In the metal processing industry, grinding is one of the most critical steps in the entire finishing process as it creates high-quality smooth metal workpieces for camshafts, ball bearing, transmission shafts, and other parts that require precision and perfect finishes. The grinding abrasive finishing process plays an important role in the manufacture of parts for the digital consumer electronics, automotive, aerospace and semiconductor industries.
Okamoto Line Up of Grinding Machines Deliver Highly Accurate Finished Products
Manual Grinders

Surface Grinding Machines
Used to produce flat, contoured, angled or irregular surfaces, surface grinding is the most reliable and efficient method, and therefore the most widely used method for obtaining a clean workpiece surface. Okamoto has a wide array of surface grinders to meet all your grinding production requirements including automatic, CNC and single and double column. 
Internal Grinding Machines

Cylindrical Grinding Machines

Rotary Grinders
With a powerful 10hp grinding spindle motor and rigid heavy
Specialty Grinders

Okamoto also offers a line of grinders specifically for the intricate semi-conductor industry. Okamoto has back grinders, polishers, slicers, and lapping machines designed specifically for materials such as Silicon, GaAs, Sapphire, Quartz, Silicon Nitride, InP, SiC, AlTiC, and many others. They can be used for a wide range of wafer types and processes, such as SOI wafers, bonded wafers, bumped wafers, as well as TSV and MEMS processes, just to name a few.
For specific information on Okamoto models, click here.
The Okamoto Difference
Whatever your grinding needs, Okamoto has a grinding machine for all your parts finishing applications. Whether you choose manual, automatic with conversational control or full function CNC, Okamoto grinders boast powerful technology for better accuracy and quality. Top that off with options* such as upgraded spindle power, automatic wheel balancing and changing, coolant systems, dressing related options, grinding wheel balancing stands and electro-magnetic or permanent magnetic chucks, to name a few, and you’ll bring your parts to a new level.
* Depending on the model
Take the next step in keeping ahead of your competition – ask your Productivity machine tool sales representative for more information on Okamoto grinding machines today!



















